Methods for forming memory devices, and associated devices and systems

ABSTRACT

Methods of manufacturing memory devices, and associated systems and devices, are disclosed herein. In one embodiment, a method of manufacturing a memory device includes (a) removing a portion of an insulative material to define a recess, (b) forming a memory stack in the recess, and (c) etching the memory stack to define a plurality of memory elements. In some embodiments, the method can further include forming conductive vias in a remaining portion of the insulative material, and forming a metallization structure electrically coupling the conductive vias to corresponding ones of the memory elements.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/914,887, filed Jun. 29, 2020, and titled “METHODS FOR FORMING MEMORYDEVICES, AND ASSOCIATED DEVICES AND SYSTEMS,” which is incorporatedherein by reference in its entirety.

TECHNICAL FIELD

The present technology generally relates to memory devices and methodsfor manufacturing memory devices, and more particularly relates tomethods including forming an oxide in a socket region of a memory devicebefore forming memory elements of the memory device.

BACKGROUND

Memory devices are widely used to store information related to variouselectronic devices such as computers, wireless communication devices,cameras, digital displays, and the like. Information is stored byprograming different states of a memory cell. Various types of memorydevices exist, such as non-volatile memory devices (e.g., NAND Flashmemory devices) and volatile memory devices (e.g., dynamic RAM (DRAM),synchronous dynamic RAM (SDRAM), etc.).

Improving memory devices, generally, may include increasing memory celldensity, increasing read/write speeds or otherwise reducing operationallatency, increasing reliability, increasing data retention, reducingpower consumption, or reducing manufacturing costs, among other metrics.One way of reducing manufacturing costs is to improve manufacturingprocesses to increase the margin of successfully manufactured devices.Manufacturers can improve the manufacturing margin by implementingprocesses that, for example, increase the consistency or tolerance ofmanufacturing steps (e.g., removal or deposition of materials), improvethe scale of manufacturing, etc.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present technology can be better understood withreference to the following drawings. The components in the drawings arenot necessarily to scale. Instead, emphasis is placed on illustratingclearly the principles of the present technology.

FIGS. 1A-1J are enlarged side cross-sectional views illustrating variousstages in a method of manufacturing a memory device in accordance withembodiments of the present technology.

FIG. 2 is a schematic view of a system that includes a memory device inaccordance with embodiments of the present technology.

DETAILED DESCRIPTION

Embodiments of the present technology include methods of manufacturingmemory devices, and associated devices and systems. In several of theembodiments described below, for example, a method of manufacturing amemory device includes (i) removing a portion of an insulative materialto define a recess, (ii) forming a memory stack in the recess, and (iii)etching the memory stack to define a plurality of memory elements. Insome embodiments, the method can further include forming a plurality ofconductive vias in the remaining (e.g., non-etched) insulative material,and forming a metallization layer to electrically couple the conductivevias to corresponding ones of the memory elements. Accordingly, theinsulative material and the conductive vias can form a “socket” havingelectrical connections for the memory elements.

In one aspect of the present technology, the memory stack is depositeddirectly into the recess in the insulative material, and the insulativematerial is used to form the socket. In contrast, some known methods ofmanufacturing memory devices include etching a plurality of memoryelements to form a recess, and then filling the recess with aninsulative material to form a socket. Accordingly, the methods of thepresent technology do not require etching of the memory elements to forma socket. This method flow advantageously avoids exposing a portion ofthe memory elements that would otherwise be exposed during the etchingstep used to form the socket of insulating material. This can helpinhibit or even prevent contamination (e.g., oxidation) of the memoryelements. In another aspect of the present technology, the method flowis simplified as stages related to protecting and etching the memoryelements can be omitted.

Numerous specific details are disclosed herein to provide a thorough andenabling description of embodiments of the present technology. A personskilled in the art, however, will understand that the technology mayhave additional embodiments and that the technology may be practicedwithout several of the details of the embodiments described below withreference to FIGS. 1A-2 . For example, some details of memory deviceswell known in the art have been omitted so as not to obscure the presenttechnology. In general, it should be understood that various otherdevices and systems in addition to those specific embodiments disclosedherein may be within the scope of the present technology.

As used herein, the terms “vertical,” “lateral,” “upper,” “lower,”“above,” and “below” can refer to relative directions or positions offeatures in the semiconductor devices in view of the orientation shownin the Figures. For example, “upper” or “uppermost” can refer to afeature positioned closer to the top of a page than another feature.These terms, however, should be construed broadly to includesemiconductor devices having other orientations, such as inverted orinclined orientations where top/bottom, over/under, above/below,up/down, and left/right can be interchanged depending on theorientation.

A person skilled in the relevant art will recognize that suitable stagesof the methods described herein can be performed at the wafer level orat the die level. Therefore, depending upon the context in which it isused, the term “substrate” can refer to a wafer-level substrate or to asingulated, die-level substrate. Furthermore, unless the contextindicates otherwise, structures disclosed herein can be formed usingconventional semiconductor-manufacturing techniques. Materials can bedeposited, for example, using chemical vapor deposition, physical vapordeposition, atomic layer deposition, spin coating, and/or other suitabletechniques. Similarly, materials can be removed, for example, usingplasma etching, wet etching, chemical-mechanical planarization, or othersuitable techniques. A person skilled in the relevant art will alsounderstand that the technology may have additional embodiments, and thatthe technology may be practiced without several of the details of theembodiments described below with reference to FIGS. 1A-2 .

FIGS. 1A-1J are enlarged side cross-sectional views illustrating variousstages in a method of manufacturing a memory device 100 (e.g., asemiconductor device) in accordance with embodiments of the presenttechnology. Generally, the memory device 100 can be manufactured, forexample, as a discrete device or as part of a larger wafer or panel. Inwafer-level or panel-level manufacturing, a larger structure is formedbefore being singulated to form a plurality of individual structures.For ease of explanation and understanding, FIGS. 1A-1J illustrate thefabrication of a portion of a single memory device 100. However, oneskilled in the art will readily understand that the fabrication of thememory device 100 can be scaled to the wafer and/or panel level—that is,to include many more components so as to be capable of being singulatedinto two or more memory devices—while including similar features andusing similar processes as described herein.

FIG. 1A illustrates the memory device 100 after formation of a (i) firstinsulative layer 102, (ii) first conductive vias 104 extending throughthe first insulative layer 102, (iii) second conductive vias 106extending through the first insulative layer 102, and (iv) a secondinsulative layer 108 over the first insulative layer 102. The first andsecond insulative layers 102, 108 can include one or more insulativematerials such as a passivation material, dielectric material, oxide(e.g., silicon oxide), tetraethyl orthosilicate (TEOS), etc., and theinsulative material in the first and second insulative layers 102, 108can be the same or different. In a particular embodiment, the first andsecond insulative layers 102, 108 both comprise an oxide material. Thefirst and second conductive vias 104, 106 can comprise a metal such astungsten, a metal alloy, a conductive-metal containing material, etc.,and can have the same or varying dimensions (e.g., widths, diameters,etc.) and/or cross-sectional shapes (e.g., circular, polygonal,rectilinear, irregular, etc.).

In some embodiments, the memory device 100 includes a scribe region 110,a tile region 112, and a socket region 114. As described in greaterdetail below, a plurality (e.g., an array) of memory elements can beformed in the scribe and tile regions 110, 112, and electricalconnections for the memory elements can be formed in the socket region114. The scribe region 110 can be a sacrificial region used to (e.g.,destructively) test the memory elements formed in the tile region 112.In the illustrated embodiment, the first conductive vias 104 can beformed to extend through the first insulative layer 102 in the scribeand tile regions 110, 112, and the second conductive vias 106 can beformed to extend through the first insulative layer 102 in the socketregion 114.

In some embodiments, the second insulative layer 108 can have athickness or height H₁ that is selected to correspond to a final heightof the memory elements (e.g., as shown in FIG. 1H). The height H₁ canalso be selected/tuned based on time to planarity needs from potentialdishing effects from etching, polishing, and/or other downstreamprocessing steps on the memory device 100. In some embodiments, thefirst insulative layer 102 can have a thickness or height H₂ that can bethe same or different as the height H₁ of the second insulative layer108.

FIG. 1B illustrates the memory device 100 after removing the secondinsulative layer 108 from the scribe and tile regions 110, 112 to form arecess 116. A photolithography, etching, masking, and/or other suitableprocess can be used to remove the portion of the second insulative layer108 over the scribe and tile regions 110, 112. In the illustratedembodiment, the remaining portion of the second insulative layer 108 inthe socket region 114 includes a generally vertical sidewall 115 at thetransition between the tile region 112 and the socket region 114.

FIG. 1C illustrates the memory device 100 after forming/depositing (i) afirst metallization layer 118 over the first and second insulativelayers 102, 108 and (ii) a memory stack 120 over the first metallizationlayer 118. The first metallization layer 118 can comprise a metal suchas tungsten, copper, silver, aluminum, a metal alloy, a conductive-metalcontaining material, etc., and can electrically couple the firstconductive vias 104 to the memory stack 120. In the illustratedembodiment, the memory stack 120 includes a memory cell layer 122 and aselector layer 124 that can comprise, for example, one more chalcogenidematerials. In some embodiments, the memory cell layer 122 and/or theselector layer 124 can include two or more layers of differentmaterials. In some embodiments, the memory stack 120 can omit the memorycell layer 122, can omit the selector layer 124, and/or can includevarious other structures used in memory devices (e.g., other memorymaterials arranged so as to provide another memory structure and/orassociated function). The first metallization layer 118 and the memorystack 120 can be formed via sputtering, chemical vapor deposition,physical vapor deposition, atomic layer deposition, spin coating,electroplating, electro-less plating, and/or another suitable depositiontechnique.

Referring to FIGS. 1B and 1C together, the first metallization layer 118and the memory stack 120 can be formed in (i) the recess 116 in/over thescribe and tile regions 110, 112 and (ii) on the second insulative layer108 in the socket region 114. As described in detail below withreference to FIGS. 1D-1J, the memory stack 120 can be patterned in thescribe and tile regions 110, 112 to form individual memory elements,while the memory stack 120 in the socket region 114 can be removed toprovide space for electrical connections to be formed for the individualmemory elements. Accordingly, in some embodiments the firstmetallization layer 118 and the memory stack 120 need not be formed overthe second insulative layer 108 in the socket region 114.

FIG. 1D illustrates the memory device 100 after forming (i) a protectionlayer 130 over the memory stack 120 (e.g., on an upper surface of thememory cell layer 122) and (ii) a mask 132 over the protection layer 130in the scribe and tile regions 110, 112 (FIGS. 1A and 1B). In someembodiments, the protection layer is a hardmask, such as a nitridehardmask (e.g., comprising silicon nitride (SiN)). The mask 132 can be aphotomask or other mask (e.g., comprising an oxide) for inhibitingremoval of portions of the memory stack 120 below the mask 132 duringdownstream material removal stages. In the illustrated embodiment, themask 132 can define an opening or open region 134 (e.g., can be spacedapart from the sidewall 115 of the second insulative layer 108). In someembodiments, one or more sacrificial layers (e.g., carbon layers,nitride layers, etc.; not shown) can be deposited over the memory stack120 in addition to the protection layer 130.

FIG. 1E illustrates the memory device 100 after etching the memorydevice 100 to (i) form/define individual memory elements 140 in thescribe and tile regions 110, 112 and (ii) remove the memory stack 120and the first metallization layer 118 from the second insulative layer108 in the socket region 114. More specifically, with reference to FIGS.1D and 1E together, a photolithography, plasma etching, wet etching,and/or other suitable process can be used to remove the portions of thefirst metallization layer 118 and memory stack 120 exposed from the mask132. In the illustrated embodiment, after etching, the memory elements140 are arranged in columns separated by openings 141. Moreover, each ofthe memory elements 140 includes a memory cell 142 formed from a portionof the memory cell layer 122, and a selector 144 formed from a portionof the selector layer 124. The memory cells 142 are operably (e.g.,electrically) coupled to the selectors 144 and to corresponding ones ofthe first conductive vias 104 via corresponding conductive lines 146(e.g., word lines) formed from a portion of the first metallizationlayer 118. In the illustrated embodiment, the memory elements 140 extendaway from the first insulative layer 102 to an elevation that is greaterthan an elevation of the second insulative layer 108 (e.g., to anelevation above an upper surface 149 of the second insulative layer108). In other embodiments, the memory elements 140 can extend to thesame elevation or a lower elevation as the second insulative layer 108.

FIG. 1E further illustrates the memory device 100 after forming a linerlayer 148 (e.g., a sealing layer, protection layer, etc.) around each ofthe memory elements 140. The liner layer 148 can be formed around all ora portion (e.g., a top portion, a sidewall portion, etc.) of the memoryelements 140. The liner layer 148 can comprise an insulating materialsuch as silicon nitride, an oxide, etc., and is configured to protectthe memory elements 140 from contamination, damage, etc., duringdownstream manufacturing stages and/or during operation of the memorydevice 100. In some embodiments, a portion of the liner layer 148 isformed from the protection layer 130 deposited at the stage shown inFIG. 1D.

FIG. 1F illustrates the memory device 100 after depositing an insulatingmaterial 150 over the memory elements 140 and the second insulativelayer 108. In the illustrated embodiment, the insulating material 150fills the openings 141 between the memory elements 140 and includes anupper surface 152. In some embodiments, the insulating material 150 canbe a dielectric material or film that is applied via a spin-on processsuch that, for example, the upper surface 152 is generally planardespite the varying topography (e.g., varying heights, thicknesses,etc.) of the memory elements 140, the openings 141, and the secondinsulative layer 108.

FIG. 1G illustrates the memory device 100 after removing a portion ofthe insulating material 150 over the memory elements 140 and the secondinsulative layer 108. In some embodiments, the insulating material 150can be planarized/polished to remove the insulating material 150 usingplasma etching, wet etching, chemical-mechanical planarization (CMP),buffing, and/or other suitable techniques. In a particular embodiment,the insulating material 150 is removed by planarizing the upper surface152 (FIG. 1F) of the insulating material 150 using a CMP process thatstops on the liner layer 148 (e.g., nitride layer) of the memoryelements 140. In some embodiments, a portion of the insulating material150 can remain on the second insulative layer 108 as shown in FIG. 1G.

FIG. 1H illustrates the memory device 100 after furtherplanarizing/polishing the memory device 100 to remove a portion of theliner layers 148 of the memory elements 140 to expose the memory cells142. In some embodiments, after planarization, the memory elements 140extend to an elevation that is the same as or about the same as theelevation of the upper surface 149 of the second insulative layer 108.Accordingly, the memory device 100 can have a generally planar uppersurface after planarization. The memory device 100 can beplanarized/polished using plasma etching, wet etching,chemical-mechanical planarization (CMP), buffing, and/or other suitabletechniques.

FIG. 1I illustrates the memory device 100 after formation of thirdconductive vias 160 through the second insulative layer 108. Only one ofthe third conductive vias 160 is shown in FIG. 1I for the sake ofillustration. In some embodiments, the third conductive vias 160 areformed by a suitable masking, etching, and deposition process. Forexample, a photolithography and/or etching process can be used to etchhigh-aspect ratio holes through the second insulative layer 108, andthen conductive material can be deposited into the holes to form thethird conductive vias 160 using chemical vapor deposition, physicalvapor deposition, atomic layer deposition, spin coating, electroplating,electro-less plating, and/or another suitable technique.

FIG. 1J illustrates the memory device 100 after formation/deposition ofa second metallization layer 170 over the memory elements 140, theinsulating material 150, the second insulative layer 108, and the thirdconductive vias 160. The second metallization layer 170 can comprise ametal such as tungsten, a metal alloy, a conductive-metal containingmaterial, etc., and can be formed via sputtering, chemical vapordeposition, physical vapor deposition, atomic layer deposition, spincoating, electroplating, electro-less plating, and/or another suitabledeposition technique. The second metallization layer 170 electricallycouples the memory elements 140 to corresponding ones of the thirdconductive vias 160. Accordingly, the memory elements 140 areelectrically accessible via the first and second conductive vias 104,106. In some embodiments, the second metallization layer 170 can bepatterned to, for example, form conductive lines (e.g., bit lines) thatare electrically coupled to a portion/subset of the memory elements 140.In some embodiments, the second metallization layer 170 includesconductive lines that extend generally perpendicular to the conductivelines 146 of the first metallization layer 118.

In some embodiments, the formation of the third conductive vias 160(FIG. 1I) and the formation of the second metallization layer 170 (FIG.1J) can be combined into a single step. For example, the metal used toform the second metallization layer 170 can be deposited over the memoryelements 140, the insulating material 150, the second insulative layer108, and the third conductive vias 160 at the same time as the metal isdeposited into the holes used to form the third conductive vias 160.

In operation, each of the memory cells 142 can store a bit of data andcan be written to (e.g., accessed) by varying a voltage supplied to thecorresponding one of the selectors 144 via the conductive lines 146(e.g., the first metallization layer 118) and/or the secondmetallization layer 170. More specifically, applying the voltage to theselectors 144 can cause/initiate a bulk property change in the materialof the corresponding memory cells 142, which modifies the resistancelevel of the memory cells 104. The memory cells 104 can have either ahigh-resistance state or a low-resistance state that can be read as a 1or a 0. In some embodiments, the memory cells 142 are non-volatile. Thefirst and second conductive vias 104, 106 can be used to operably couplethe memory device 100 to external devices (e.g., a processor device)and/or to other components (e.g., other memory devices) within anintegrated memory package. As one of ordinary skill in the art willappreciate, the memory device 100 can be further “packaged” forprotection and to include appropriate electrical interconnections.

The manufacture of some memory devices includes forming an array ofmemory elements before removing a portion of the memory elements to forma socket including electrical connections for the memory elements. Forexample, U.S. patent application Ser. No. 16/780,594, filed Feb. 3,2020, and titled “METHODS FOR FORMING MEMORY DEVICES, AND ASSOCIATEDDEVICES AND SYSTEMS,” describes such methods, and is incorporated hereinby reference in its entirety. Referring to FIGS. 1A-1J together, in oneaspect of the present technology the second insulative layer 108 isformed before the memory elements 140. Accordingly, the memory stack 120is deposited directly into the recess 116 in the second insulative layer108, and the memory stack 120 does not need to be etched/removed to forma socket for the second insulative layer 108 and the third conductivevias 160. This method flow avoids exposing a portion of the memoryelements 140 (e.g., a row of the memory elements 140 adjacent thesidewall 115 of the second insulative layer 108) during an etching stepto form the socket of insulating material. This can help inhibit or evenprevent contamination (e.g., oxidation) of the memory elements 140. Inanother aspect of the present technology, the flow is simplified asthere is no need to etch a portion of the memory elements 140 and tosubsequently deposit the second insulative layer 108 in the socketregion 114. For example, steps to protect the memory elements 140 in thescribe and tile regions 110, 112 during etching can be omitted andreplaced with a simple masking/etching step to form the recess 116 inthe second insulative layer 108 (FIG. 1B).

In some embodiments, the memory device 100 can include one or moreadditional layers of memory elements above the memory elements 140,thereby forming a three-dimensional (3D) memory array. In someembodiments, the one or more additional layers can be formed in agenerally similar or identical manner to the single layer illustrated inFIGS. 1A-1J. For example, (i) first and second insulative layers can beformed on/above the second metallization layer 170 and conductive viascan be formed through the first insulative layer (e.g., as in FIG. 1A),(ii) the second insulative layer can be recessed (e.g., as in FIG. 1B),(iii) a memory stack can be deposited in the recess (e.g., as in FIG.1C), and so on. In some embodiments, the tile regions 112 and/or thesocket regions 114 for each subsequent layer of memory elements can beat least partially offset (e.g., laterally offset) from one another toprovide space for the conductive vias.

The memory device 100 described in detail above with reference to FIGS.1A-1J and/or packages incorporating the memory device 100 can beincorporated into any of a myriad of larger and/or more complex systems,a representative example of which is system 280 shown schematically inFIG. 2 . The system 280 can include a processor 282, a memory 284 (e.g.,SRAM, DRAM, flash, and/or other memory devices), input/output devices286, and/or other subsystems or components 288. The memory devicesand/or packages described above with reference to FIGS. 1A-1J can beincluded in any of the elements shown in FIG. 2 . The resulting system280 can be configured to perform any of a wide variety of suitablecomputing, processing, storage, sensing, imaging, and/or otherfunctions. Accordingly, representative examples of the system 280include, without limitation, computers and/or other data processors,such as desktop computers, laptop computers, Internet appliances,hand-held devices (e.g., palm-top computers, wearable computers,cellular or mobile phones, personal digital assistants, music players,etc.), tablets, multi-processor systems, processor-based or programmableconsumer electronics, network computers, and minicomputers. Additionalrepresentative examples of the system 280 include lights, cameras,vehicles, etc. With regard to these and other example, the system 280can be housed in a single unit or distributed over multipleinterconnected units, for example, through a communication network. Thecomponents of the system 280 can accordingly include local and/or remotememory storage devices and any of a wide variety of suitablecomputer-readable media.

From the foregoing, it will be appreciated that specific embodiments ofthe technology have been described herein for purposes of illustration,but that various modifications may be made without deviating from thedisclosure. Accordingly, the invention is not limited except as by theappended claims. Furthermore, certain aspects of the new technologydescribed in the context of particular embodiments may also be combinedor eliminated in other embodiments. Moreover, although advantagesassociated with certain embodiments of the new technology have beendescribed in the context of those embodiments, other embodiments mayalso exhibit such advantages and not all embodiments need necessarilyexhibit such advantages to fall within the scope of the technology.Accordingly, the disclosure and associated technology can encompassother embodiments not expressly shown or described herein.

I claim:
 1. A method of manufacturing a memory device, the methodcomprising: forming a memory stack in a recess of an insulative materialby— forming a metallization layer in the recess; depositing a selectorlayer in the recess over the metallization layer; depositing a memorycell layer over the selector layer; and etching the memory stack todefine a plurality of memory elements.
 2. The method of claim 1 whereinetching the memory stack to define the memory elements includes etchingthe metallization layer to form a plurality of conductive lineselectrically coupled to corresponding ones of the memory elements. 3.The method of claim 1 wherein the method further comprises formingconductive vias through the insulative material.
 4. The method of claim3 wherein the metallization layer is a first metallization layer, andwherein the method further comprises forming a second metallizationlayer over the memory elements and the conductive vias such that thesecond metallization layer electrically couples the conductive vias tocorresponding ones of the memory elements.
 5. The method of claim 1wherein the insulative material is an oxide material.
 6. The method ofclaim 1 wherein at least one of the selector layer and the memory celllayer include a chalcogenide material.
 7. The method of claim 1 whereinthe insulative material has an upper surface, and wherein forming thememory stack in the recess includes forming the memory stack to have anelevation greater than an elevation of the upper surface of theinsulative material.
 8. The method of claim 1 wherein the method furthercomprises forming a protective liner around individual ones of thememory elements.
 9. A method of manufacturing a memory device, themethod comprising: forming a memory stack in a recess in an insulativematerial such that the memory stack has an elevation greater than anelevation of an upper surface of the insulative material; etching thememory stack to define a plurality of memory elements; and planarizingthe memory elements to have a same elevation as the elevation of theupper surface of the insulative material.
 10. The method of claim 9wherein at least one of the selector layer and the memory cell layerinclude a chalcogenide material.
 11. The method of claim 9 wherein themethod further comprises: depositing a dielectric material over thememory elements and the upper surface of insulative layer; and afterdepositing the dielectric material, planarizing the dielectric materialto remove the dielectric material over the upper surface of theinsulative layer.
 12. The method of claim 9 wherein the method furthercomprises: forming conductive vias through the insulative material; andforming a metallization layer over the memory elements and theconductive vias, wherein the metallization layer electrically couplesthe conductive vias to corresponding ones of the memory elements.
 13. Amethod of manufacturing a memory device, the method comprising: forminga plurality of memory elements in a recess of a tile region of a secondinsulative layer, wherein the second insulative layer is positioned overa first insulative layer; forming a plurality of first conductive viasin a socket region of the second insulative layer; forming a pluralityof second conductive vias in the first insulative layer; forming a firstmetallization layer electrically coupling the first conductive vias tocorresponding ones of the memory elements; and forming a secondmetallization layer electrically coupling the second conductive vias tocorresponding ones of the memory elements.
 14. The method of claim 13wherein individual ones of the memory elements include a selectoroperably coupled to a memory cell, wherein the first metallization layerelectrically couples the first conductive vias to corresponding ones ofthe memory cells, and wherein the second metallization layerelectrically couples the second conductive vias to corresponding ones ofthe selectors.
 15. The method of claim 13 wherein the memory elementsinclude a chalcogenide material.
 16. A method of manufacturing a memorydevice, the method comprising: forming a plurality of memory elements ina recess of a tile region of a second insulative layer, wherein thesecond insulative layer is positioned over a first insulative layer, andwherein forming the memory elements in the recess includes— depositing aselector layer in the recess; depositing a memory cell layer over theselector layer; and etching the selector layer and the memory cell layerto form the memory elements; and forming a plurality of conductive viasin a socket region of the second insulative layer.
 17. The method ofclaim 16 wherein at least one of the selector layer and the memory celllayer include a chalcogenide material.
 18. A method of manufacturing amemory device, the method comprising: forming a memory stack in a recessof an insulative material by— depositing a selector layer in the recess;depositing a memory cell layer over the selector layer; and etching thememory stack to define a plurality of memory elements; forming aprotective liner around individual ones of the memory elements; andremoving a portion of the protective liner around the memory elements toexpose a memory cell of each of the memory elements.
 19. A method ofmanufacturing a memory device, the method comprising: forming a memorystack in a recess of an insulative material by— depositing a selectorlayer in the recess; depositing a memory cell layer over the selectorlayer; and etching the memory stack to define a plurality of memoryelements; depositing a dielectric material over the memory elements andan upper surface of the insulative material; and removing the dielectricmaterial over the upper surface of the insulative material.